LevelC-UNLIM. 0 to 74F SN74FNSRG4. ACTIVE. SO. NS. . Reproduction of significant portions of TI information in TI data sheets is . 74F datasheet, 74F circuit, 74F data sheet: FAIRCHILD – Dual JK Negative Edge-Triggered Flip-Flop,alldatasheet, datasheet, Datasheet search site. 74F Datasheet, 74F Dual J-K Negative Edge-triggered Flip-Flop Datasheet, buy 74F
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Datasheet archive on 3-7-2014
Documents Flashcards Grammar checker. A low level at the preset PRE or clear CLR inputs sets or resets the outputs regardless of the levels of the other inputs. When PRE and CLR are inactive highdata at the J and K inputs meeting the setup time requirements is transferred to the outputs on the negative-going edge of the clock pulse.
Clock triggering occurs at a voltage level and is not directly related to the rise time of the clock pulse. Following the hold-time interval, data at the J and K inputs may be changed without affecting the levels at the outputs. Furthermore, this configuration is nonstable; that is, it will not persist when either PRE or CLR returns to its inactive high level. Products conform to specifications per the terms of Texas Instruments standard warranty.
Production processing does not necessarily include testing of all parameters. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. The input voltage ratings may be exceeded provided the input current ratings are observed. ICC is measured with all outputs open, the Q and Q outputs alternately high and the clock input grounded at the time of measurement.
Load circuits and waveforms are shown in Section 1.
Product device recommended for new designs. TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
74F 데이터시트(PDF) – NXP Semiconductors
Device has been announced but is not in production. Samples may or may not be available.
TI has discontinued the production of the device. TI’s terms “Lead-Free” or “Pb-Free” mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.
Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. This component has a RoHS exemption for either 1 lead-based flip-chip solder bumps used between the die and package, or 2 lead-based die adhesive used between the die and leadframe. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. Finish options are separated by a vertical ruled line.
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74F Datasheet PDF – Fairchild Semiconductor
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