The company has grown since then to more than employees today. Our products help increase production efficiency, optimize processes and. The microDICE™ laser micromachining system leverages TLS-Dicing™.
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With that we have established a strong foundation for dynamic growth in international markets.
3D-Micromac – Micromachining Excellence
micomac The project aims to develop large-scale lighting applications using organic light-emitting diodes OLEDs on flexible substrates. This collaboration will strengthen the competitiveness of the semiconductor and system suppliers to design innovative MtM and SiP products in respect to reliability, quality, cost and shorter time to market to ensure leadership in a global perspective. This especially applies to the excimer and ultra-short pulse laser systems, as well as the roll-to-roll laser machining of flexible substrates.
This has created a greater need for methods of processing surface layers of the device without affecting buried structures, as well as selective exposure of functional areas on the device. As a result, chip manufacturers are turning toward vertical stacking of devices and heterogenous integration schemes to enable smaller, higher-performance devices. Thereto 3 project part of 3D-Micromac will provide an miccromac contribution: Cost, quality and throughput are major factors in achieving successful manufacturing in the semiconductor industry.
Microdiagnostics and Failure Analysis.
Firstly the developments are oriented to the state of the art. The utilization of lasers possessing highest beam quality ensures excellent machining results regarding surface and edge quality micromxc a minimum of damage to the material and marginal materials loss.
In addition, 3D-Micromac has mocromac fully equipped application laboratory with experienced process engineers to support customers in feasibility tests, process development, and realization of customized solutions.
Therefore, we are very proud to be certified to the ISO quality standard since Those properties should be unchanged after cutting. Since we place great importance on continually expanding our know-how, we are diligent about keeping up with the latest research.
Our innovations are built on more than ten years of expertise in laser micromachining. The system features a line scan option for vertical selective annealing and a step-and-repeat spot option for horizontal selective annealing, as well as three optional wavelength lasers near infrared, green and ultravioletresulting in a highly flexible, high-quality laser annealing platform.
As a result of the project, demonstrators are being developed that illustrate the power of the technology. The four major European semiconductor and microjac suppliers Infineon, STMicroelectronics, Bosch midromac Thales will collaborate with eleven equipment and analytical method suppliers from Germany and France.
Display and Smart Glasses.
Markets – Laser Micromachining – 3D-Micromac AG
Furthermore a technology for cutting solar cells is especially interesting for national producers of special solar modules who can use it for the production of special formed modules. Target of this project is to explore and to develop new diagnostic tools and advanced methods for material characterization, defect localization, efficient sample preparation, physical failure analysis techniques and workflows to enable reliable advanced micro-systems based on MtM, SiP, and 3D technologies for European core applications.
Opening of the company headquarters at the Chemnitz Technology Campus The main goal is to separate the cells without inducing damage at the cutting edge. With this certification, we prove our successful quality management and the efficiency of our process chains as well as our efforts to a continuous improvement.
This opens up a huge variety of possibilities and niche applications for BIPV. Today, however, the use of ultrashort pulses and optimized processing routes is addressing these concerns and enabling laser processing to finally enter the scene — speeding up microstructure diagnostics and failure analysis as well as opening up access to deeply buried structures and large-area preparation.
All components have to be adapted to the requirements of the new high efficiency laser processes. Extremely precise positioning systems, innovative beam-delivery concepts as well as numerous process monitoring methods offer the highest possible process reliability and a maximum speed of machining. More-than-Moore MtMSystem-in-Package SiPas well as 3D high-density integration technologies are a prerequisite for enabling the design of compact microelectronic devices e.
Our aim is to provide superb customer satisfaction even for the most complex projects. Innovative laser processes are revolutionizing industrial manufacturing worldwide. The different processing methods that are realized with our laser systems include micro drilling, signing, cutting, 2D and 3D structuring, welding as well as marking of different materials and thin films. Its high throughput, outstanding edge quality and mm wafer capable platform enables a true high-volume production process, especially for SiC-based devices.
Company – Laser Micromachining – 3D-Micromac AG
Microstructure diagnostics and failure analyses are pivotal for the ongoing improvement of functional materials and sophisticated electronic components. These platforms are open to multiple users and for multiple applications.
We also specialize in the use of excimer lasers for microprocessing. The certification covers the entire spectrum of development, production, sales and service of our machines, plants and technologies.